Fertigungsgerüchte: Apple- und Intel-CPUs ab 2023 mit TSMCs 3 nm from Heise's blog
Untypisch: Außer Apple soll auch Intel zu den ersten Großkunden von TSMCs Fertigungsprozess mit 3-Nanometer-Strukturen gehören.
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| By | Heise |
| Added | Jul 2 '21, 05:44PM |
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